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    ID 26521963 © Luchschen - Dreamstime.com
    promo_pam4__id_26521963__luchschen__dreamstime
    TeraSignal's TS9802 Intelligent TIA incorporates diagnostics without a DSP.
    75868080 © Vladimir Timofeev | Dreamstime.com
    Marvell_Ara_DSP_Data_Center_Promo
    By upgrading to the 3-nm process, Marvell is positioning the new Ara DSP to be a key building block of 1.6-Tb/s optical modules in the data center.
    Molex
    Molex VersaBeam
    Molex's VersaBeam EBO Interconnect delivers low-loss, high-density fiber connections.
    Inventive Resources
    Enclosure_Protection_Attachment_Inventive_Promo
    The Enclosure Protector Attachment (EPA) from Inventive Resources balances internal and external air pressure to prevent contaminants from leaking into the enclosure.
    Molex
    Molex HSAutoLink C Interconnect
    Molex HSAuto Link C interconnect solution provides USCAR Type C compatibility for automotive USB connections.

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    ID 217230663 © Christian Offenberg - Dreamstime.com | electronica.de
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    Bourns
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    Bourns’ latest series of low-profile shielded power inductors feature flat wire windings that deliver improved efficiency and a smaller form factor.
    Pickering Electronics
    Pickering’s Series 125 is the industry’s smallest DPST reed relay.
    According to Pickering, its latest Series 125 is the industry’s tiniest DPST reed relay, switching up to 1 A, 20 W in a 5- x 5-mm pitch.
    What’s the Difference Between PCI Gen 5 and Gen 6?
    A slew of updates and new features and comes with the PCIe 6 standard, including double the data rate and a switch to PAM4 signaling.