6890d0ae07903f305bc3f473 Promo Fms 2025 Fmsnew

Future of Storage and Memory Conference 2025

Aug. 4, 2025

Check out the latest technology presented at this year's FMS conference.

Related To:

There's a lot being shown at this year's conference (being held August 5-7), from high-capacity solid-state disks (SSDs) to disaggregated memory via Compute Express Link (CXL). We have some preshow announcements as well as embargoed details that will be posted when the show starts. Check back later as we will also be posting videos shot at the show; those take a little longer to post.

Products and Technology at FMS 2025

These are a few of the new products and trends from the Future of Memory and Storage conference.

Embedded

Between the Lines: The Next Frontier in 3D NAND Flash

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it.

Boards

Storage Accelerator Speeds Up NVMe Arrays

Microchip’s SmartRAID 4300 Series, where the RAID controller works in tandem with the host, is designed to accelerate NVMe arrays.

Memory

Cold-Plate SSD Targets Liquid-Cooled Servers

Solidigm’s liquid-flow-through D7-PS1010 SSD incorporates a spring-loaded cold plate that meets the 9.5-mm E1.S standard.

Memory

UFS 4.1 Chip Handles Automotive Storage Chores

Kioxia’s latest UFS 4.1 memory chip, which more than doubles the speed of previous versions, meets automotive requirements.

Embedded

The When, Where, and Why of Using Chiplets

With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is complicated...

ARM’s Chiplet System Architecture Streamlines Chip Design

EDA

Arming a Chiplet System Architecture

Arm’s Chiplet System Architecture, which addresses key chip design challenges, builds on the Neoverse Compute Subsystem and AMBA.

EDA

UCIe: Open Chiplet Ecosystem at the Package Level

The UCIe Consortium’s Brian Rea gives a short overview of the Universal Chiplet Interconnect Express.

About the Author

William G. Wong | Senior Content Director - Electronic Design and Microwaves & RF

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I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.

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