UFS 4.1 Chip Handles Automotive Storage Chores
JEDEC’s Universal Flash Storage (UFS) 4.1 updated with a number of improvements, including host-initiated defragmentation, replay protected memory block (RPMB) authentication, and increased precision for enhanced memory logical units (LUs) that are needed to support QLC flash memory. The new standard is backwards compatible with UFS 4.x and 3.x. It employs the MIPI Alliance’s M-PHY version 5.0 specification that provides a bandwidth of 4.2 GB/s.
Kioxia’s UFS 4.1 for Cars and More
Kioxia America’s UFS 4.1 family supports the JEDEC standard and meets the requirements for automotive and other transportation applications (see figure). It’s available with capacities up to 1 TB and supports full-duplex operations. The chips utilize the company’s 3D flash-memory technology, BiCS Gen 8.
The most important aspect of the announcement is that the family meets automotive requirements. Cars are integrating a greater number of advanced driver-assistance systems (ADAS) that utilize artificial intelligence (AI). AI is more demanding when it comes to compute as well as storage. Likewise, memory and compute needs are expanding to support other automotive chores, from AI models to telematics to driver and passenger monitoring.
Kioxia’s UFS chip meets AEC-Q100/1044 Grade 2 standards. Maximum case temperature is 115°C. Overall, the UFS 4.1 chips more than double the speed compared to prior versions.