How Can Chiplets Accelerate Generative AI Applications?

March 27, 2024
This superpanel explores the role of chiplets in advancing ever-expanding generative AI technology.

Check out Electronic Design's coverage of Chiplet Summit 2024. This video is also part of the TechXchanges: Generating AI and Chiplets - Electronic Design Automation Insights.

What you’ll learn:

  • Why chiplet technology will affect embedded deployment of generative AI.
  • How chiplets will be used to accelerate generative AI.

 

Generative AI is the biggest topic in computer technology today. Everyone is talking about ChatGPT, its originator OpenAI, and its top executive Sam Altman. So, what role can chiplets play as applications roll out in areas ranging from accounting to zoology?

Surely chiplets can provide faster, more powerful AI chips, as well as devices that can bring generative AI to the edge. Also, the chiplet form can be a way to add generative AI accelerators to processor designs. Still other applications include high-speed memory and I/O devices sitting close to processors inside packages to allow for more in-memory computation and fewer data moves.

A superpanel of experts across the industry, hosted by William Wong, Senior Content Director for Electronic Design, provided their takes on chiplets and AI. The panelists included:

  • Nick Ilyadis, Vice President of Product Planning at Achronix. He’s a recognized software and hardware development and quality control expert with over 35 years of data and semiconductor engineering and manufacturing experience, and 72 issued patents.
  • Durgesh Srivastava, Senior Director Hardware Engineering at NVIDIA. He drives Arm’s Server SoC architecture for cloud and enterprise applications, focusing on rack-level optimizations and memory disaggregation.
  • Rohit Mittal, Systems and Silicon Lead at Google. He works on tensor processing units (TPUs) that power AI in Google. Before joining Google, he was director in Intel’s Cloud and Data Center Products Groups, leading product development and management organizations for servers, silicon photonics, and networking.
  • Paul Fahey, Vice President of Technology at SK Hynix. He’s active with JEDEC and is involved in HBM marketing.
  • Kevin Chen heads the corporate VC group of Lam Research, which invests across the semi ecosystem.  Previously, he’s led product marketing and development teams at Applied Materials and AMD, and served as CEO of a VC-backed tech startup.
  • Paul Borrill, Chief Product Officer at Daedaelus and an expert on software infrastructures. He contributed to systems development at NASA, Sun Microsystems, Quantum, VERITAS, and Apple. Paul co-founded the IEEE Hot Interconnects Symposium and the Storage Networking Industry Association (SNIA).

Check out more of our coverage of Chiplet Summit 2024 and other videos/articles in the TechXchanges: Generating AI and Chiplets - Electronic Design Automation Insights.

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