• Home >
  • Back Issues >
  • Top Stories of the Week >
  • Chiplet Summit 2024
  • Chiplet Summit 2024

    Heterogeneous 2
    June 3, 2024
    Siemens’ Xpedition Substrate Integrator provides co-design prototyping and planning of 2.5/3D chips.
    Chiplets connected via the Universal Chiplet Interconnect Express
    May 25, 2024
    Cadence's UCIe demo presents key features and interoperability support, and also discusses the future of chiplet technology in high-performance SoCs.
    Andrei Dzemidzenka, Dreamstime
    April 3, 2024
    Learn more about Pike Creek and its potential implications as the first test chip featuring chiplets linked by the UCIe standard.
    How Chiplets Accelerate Generative AI Applications
    March 27, 2024
    This superpanel explores the role of chiplets in advancing ever-expanding generative AI technology.
    What will Chiplets Look Like in 2029?
    March 11, 2024
    Wrapping up the 2024 Chiplet Summit, this panel session discussed the huge advantages and persistent challenges presented by chiplets.

    More content from Chiplet Summit 2024

    Multi-Die Systems Set the Stage for Innovation
    Feb. 21, 2024
    Abhijeet Chakraborty, Vice President of Engineering at Synopsys, in his keynote at the 2024 Chiplet Summit, said that last year was an inflection point for multi-die systems.
    91824901 © Forance | Dreamstime.com
    Feb. 8, 2024
    Explore Keysight’s Chiplet PHY Designer tool and the game-changing UCIe standard in chip design.
    Can Chiplets Solve Semiconductor Challenges?
    Dec. 13, 2023
    With the right investments, chiplets can help solve long-standing industry challenges such as increasing costs and supply disruptions, resulting in a world where devices are more...