Optical Chiplet Interconnect Promises to Accelerate Computing Apps

Avicena’s founder and CEO breaks down the challenges of intra-chip data management and how his company’s LightBundle platform offers a solution.
Sept. 17, 2024

The growth in high-performance computing and AI in advanced chip architectures is creating issues when it comes to intra-chip data management, especially as they migrate to chiplet-based topologies. Addressing this chip-level issue, Avicena announced its scalable LightBundle chiplet interconnect solution. It offers ultra-high-density die-to-die connections with a multi-Tb/s/mm shoreline bandwidth density at sub-pJ/bit energy efficiency.

In this podcast we talk to Bardia Pezeshki, founder and CEO of Avicena, about the issues of intra-chip data management and his company’s solution.

>>Check out these TechXchanges for similar podcasts, articles, and videos

Electronic Design
inside_electronics_promo
Check out our latest podcast featuring Alix Paultre, along with other special hosts from our editorial staff.
ed_promo
Mixing dies, interposers, and designs to fabricate new solutions.

About the Author

Alix Paultre

Editor-at-Large, Electronic Design

An Army veteran, Alix Paultre was a signals intelligence soldier on the East/West German border in the early ‘80s, and eventually wound up helping launch and run a publication on consumer electronics for the US military stationed in Europe. Alix first began in this industry in 1998 at Electronic Products magazine, and since then has worked for a variety of publications in the embedded electronic engineering space. Alix currently lives in Wiesbaden, Germany.

Also check out his YouTube watch-collecting channel, Talking Timepieces

Sign up for our eNewsletters
Get the latest news and updates

Voice Your Opinion!

To join the conversation, and become an exclusive member of Electronic Design, create an account today!