On-Package Chiplet Innovations with UCIe

Get the latest information about the Universal Chiplet Interconnect Express (UCIe) and its current incarnation, UCIe 3.0.
March 26, 2026
2 min read

What you'll learn:

  • The motivation of chiplets and UCIe.
  • What’s in UCIe 3?

Chiplets have changed the way high-performance processors, GPUs, and artificial-intelligence (AI) accelerators are built. High bandwidth memory (HBM) is just one type of chiplet, but it makes a significant difference in chip performance by providing very wide, very fast memory interfaces for compute engines that demand more accelerated memories.

Dr. Debendra Das Sharma, Intel Senior Fellow and Chair of the UCIe Consortium, gave this keynote presentation at the 2026 Chiplet Summit. By definition, chiplets need to be connected together to form a useful chip. One way to do this is via Universal Chiplet Interconnect Express (UCIe). Chiplets are needed to address a range of issues, including the reticle limit that’s hampering large die often required for GPUs and AI accelerators (Fig. 1).

The latest version is UCIe 3.0, which brings more functionality and faster transfer rates (Fig. 2). UCIe can now deliver up to 64 Gtransfers/s. These on-chip interconnects are faster and more efficient than off-chip connections, and multiple dies can be supported in a single chip package.

Using a standard like UCIe will allow designers to develop systems more quickly and make a chiplet marketplace practical, since connectivity is key to its success.

>>Check out more of our Chiplet Summit 2026 coverage

Santa Clara Convenction Center | Chiplet Summit
Chiplet Summit at the Santa Clara Convenction Center
Check out the breaking news, videos, and podcasts coming from this year's Chiplet Summit.

About the Author

William G. Wong

Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form. 

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

You can visit my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

Sign up for our eNewsletters
Get the latest news and updates

Voice Your Opinion!

To join the conversation, and become an exclusive member of Electronic Design, create an account today!