Latest Technology at the 2026 Chiplet Summit

Check out the breaking news, videos, and podcasts coming from this year's Chiplet Summit.
Related To: 
Feb. 17, 2026

Key Highlights

  • Find out what's up with chiplets
  • Is UCIe taking over? 
  • Issues and answers about chiplets
Santa Clara Convenction Center | Chiplet Summit
Chiplet Summit at the Santa Clara Convenction Center

Welcome to Electronic Design's coverage of the 2026 Chiplet Summit. You can find links to our latest articles, videos, and podcasts. Keep checking back as more content is added regularly. You can sign up for our daily newsletter to see the latest articles as they're posted. Also check out our other newsletters.

Featured Content

William Wong | Santa Clara Convention Center
Santa Clara Convention Center
Editor Bill Wong’s observations from the recent 2026 Chiplet Summit.
ID 78081816 | Maksym Filipchuk | Dreamstime.com
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The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as key enablers of future designs.
ID 344272177 © Photomoon19 | Dreamstime.com
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JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
Tenstorrent
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Tenstorrent’s TT-QuietBox packs in four Blackhole p150c Tensix Processors.
Empower Semiconductor
Empower Semiconductor embedded silicon capacitors
Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
William Wong – EndeavorB2B
Chiplet Summit 2026
Join Editor Bill Wong at the 2026 Chiplet Summit, which is being held on Feb. 17th through the 19th.

Multimedia

Here are our latest videos and podcasts.

Examining a Physical AI Chiplet Platform
Mick Posner highlights Cadence’s chiplet platform to support physical AI development.
Women in Chiplets Summit Session
A panel of leading women in semiconductors at the 2026 Chiplet Summit discuss AI’s impact on engineering careers, mentoring future generations, and gender dynamics in technical...
Chiplets Summit Award Session
The winners for this year's Chiplet Summit awards are: Packaging: Design - Siemens Innovator 3D IC (watch the Innovator 3D IC) Packaging: Hardware - Sarcina Technology...
Driving Innovation in 3d IC Chiplet Summit
Find out about design trends, challenges, and solutions around 3D ICs.

More Show Coverage

The Featured Articles above are just some of the content that's new on Electronic Design. Check out the rest here.

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Accellera supports cutting-edge EDA standards designed to streamline chip and system development tools.
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This article presents a step-by-step process for importing two types of third-party SPICE models into LTspice: models implemented with .MODEL directives and those implemented ...
Shown are low-end, mid-range, and high-end chiplet systems (representative architectural diagrams, not drawn to scale).
Unlock the future of semiconductor innovation with chiplets — enabling scalable, cost-effective designs and paving the way for a reusable chip marketplace.
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Metastability can’t be avoided during clock domain crossing. Understanding how a sequential element might enter metastability and the probability of its failure is paramount in...

Past Show Coverage from the Electronic Design Archives

These articles and videos were chosen by the editors at Electronic Design from past shows.

Mick Posner talks about the importance of UCIe
Synopsys’ Mick Posner talks about the Universal Chiplet Interconnect Express and its importance in today’s designs.
Embracing the Chiplet Journey
How can chiplets address the ever-increasing compute demands of SoCs and processors?
Tools for Testing Chiplet-based Designs
Testing chiplet designs requires an integrated toolset like the BERTs available from Keysight.
A Quick Look at Keysight’s PHY Designer
The Chiplet PHY Designer can model and analyze D2D PHY chiplet systems from transmitter to receiver.
What is VisualSim Architect?
Developed by Mirabilis Design, VisualSIM Architect provides modeling and simulation design support.

More Event Coverage on Electronic Design

These articles were chosen by the editors at Electronic Design from past shows.

William Wong | EndeavorB2B
Tradeshow floor
Check out Electronic Design's coverage of the latest tradeshows.
Santa Clara Convention Center | Chiplet Summit
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Check out the 2025 Chiplet Summit to be held from January 21-23 at the Santa Clara Convention Center.

About the Author

William G. Wong
Email

William G. Wong

Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form. 

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

You can visit my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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