Addressing Multi-Die Chiplet Design Challenges

Synopsys' Abhijeet Chakraborty talks about chiplet trends, challenges, and solutions.
March 12, 2026

What you'll learn:

  • Why today's 3D ICs are really large systems.
  • Why security is important to the chiplet supply chain.

I talked with Abhijeet Chakraborty, Vice President Engineering at Synopsys, about multi-die ICs and where chiplets are headed (watch video above). Synopsys has been at the forefront of chiplet designs with tools like its 3DIC Compiler (see figure). Abhijeet addresses questions about securing the chiplet supply chain as well as how artificial intelligence (AI) affects the tools and system designs. 

The 3DIC Compiler combines many of Synopsys' tools, such as RedHawk-SC, RedHawk-SC Electrothermal, and Ansys HFSS-IC. These provide "automation and optimizations for multiphysics analysis including power and signal integrity, thermal, and mechanical stress." The AI capabilities of the compiler are used to improve development times as well as optimize the system design. It's certified by major foundries.

Read more about the 2026 Chiplet Summit

Santa Clara Convenction Center | Chiplet Summit
Chiplet Summit at the Santa Clara Convenction Center
Check out the breaking news, videos, and podcasts coming from this year's Chiplet Summit.
William Wong | Santa Clara Convention Center
Santa Clara Convention Center
Editor Bill Wong’s observations from the recent 2026 Chiplet Summit.

About the Author

William G. Wong

Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

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I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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