What types of fabrics can connect chiplets together?
What is a software-defined fabric?
How do you build multi-die coherent networks?
Kent Orthner, Principal Solutions Architect at Baya Systems, talks about multi-die coherent networks and how this software fabric approach works with chiplets (watch the video above). Essentially, chiplets require one or more network-on-chip (NoC) subsystems to tie together the functional blocks. These can be a mix of coherent and non-coherent NoCs. The Baya Systems design flow allows designers to design these systems (see figure).
Baya Systems
With the Baya Systems design flow, designers can specify coherent and non-coherent NoCs and show how they fit in the overall chip design.
Baya Systems’ tools address on-die as well as cross-die and cross-chip communication. This includes support for multi-chiplet coherency, global address maps, and deadlock avoidance across dies and chips. The tools can be used for traffic simulation.
Kent Orthner serves as Principal Solutions Architect at Baya Systems. Kent previously held senior leadership roles at Achronix Semiconductor Corp. Earlier experience includes positions at Arteris, Altera, Accelight, and Furukawa. He holds a Master of Engineering in Electrical Engineering from Carleton University and a Bachelor of Applied Science in Computer Engineering from the University of Ottawa.
