What’s Next for Chiplets in 2026?

Join Editor Bill Wong at the 2026 Chiplet Summit, which is being held on Feb. 17th through the 19th.
Feb. 11, 2026
2 min read

What you’ll learn:

  • What to see at the Chiplet Summit.
  • The panel sessions and keynotes you should check out.

I’ve been a bit remiss with writing up a preview for this year’s Chiplet Summit at the Santa Clara Convention Center, taking place from Feb. 17-19. Then again, I host three panel sessions at the conference this time and CES was just a little while ago, so I hope you’ll give me a break. I also hope you’ll stop by to see my panel sessions:

  • Superpanel: Best Way to Make Chiplets Work
  • Links War Panel
  • Chiplets in 2031 and How We Got There

Plans are to have videos of these, but it will be a while before they’re up.

There are quite a few keynotes, starting with Abhijeet Chakraborty, VP of Engineering at Synopsys, talking about “Designing the Future Today: AI-Driven Multi-Die Design.” If you can make it, you’ll hear more about topics from the chiplet ecosystem, such as “Enabling an Open Chiplet Ecosystem at the Package Level” courtesy of the UCIe’s Debendra Das Sharma.

The technical sessions are what most will want to explore. They cover many topics from “HBM (high bandwidth memory) Interfacing” to “Applying Die-to-Die Interfaces.” Stick around to find out about UCIe Version 3.0.

The chiplet market is still in its infancy, dominated by the big players like NVIDIA that utilize chiplets like HBM memory and incorporate artificial-intelligence (AI) acceleration into systems that exceed the current die-size limits. Some of my panels will touch on the challenges of making chiplets more available to developers. Will AI come into play for chiplet design and chiplet-based system design? It already has.

Stop by the conference if you can, as it should prove very interesting and enlightening.

About the Author

William G. Wong

Senior Content Director - Electronic Design and Microwaves & RF

I am Editor of Electronic Design focusing on embedded, software, and systems. As Senior Content Director, I also manage Microwaves & RF and I work with a great team of editors to provide engineers, programmers, developers and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

You can send press releases for new products for possible coverage on the website. I am also interested in receiving contributed articles for publishing on our website. Use our template and send to me along with a signed release form. 

Check out my blog, AltEmbedded on Electronic Design, as well as his latest articles on this site that are listed below. 

You can visit my social media via these links:

I earned a Bachelor of Electrical Engineering at the Georgia Institute of Technology and a Masters in Computer Science from Rutgers University. I still do a bit of programming using everything from C and C++ to Rust and Ada/SPARK. I do a bit of PHP programming for Drupal websites. I have posted a few Drupal modules.  

I still get a hand on software and electronic hardware. Some of this can be found on our Kit Close-Up video series. You can also see me on many of our TechXchange Talk videos. I am interested in a range of projects from robotics to artificial intelligence. 

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