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    Electronic Design and Phlux Technology
    Transimpedance amplifier (TIA)
    IBM
    IBM's co-packaged optic module
    Chalmers University of Technology and KAIST
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    Bdieseldorff - Own work, CC BY-SA 3.0, https://commons.wikimedia.org/w/index.php?curid=3936976
    K2-W op amp
    Dreamstime_stononame_244591428
    Test equipment
    ID 324011679 © Valeriidekhtiarenko | Dreamstime.com (AI generated)
    evcharging_dreamstime_l_324011679
    BRM Aero | Anna Pizzolante
    BRM Aero’s Bristell Energic
    ID 324703167 © Valeriya Ignatenko | Dreamstime.com
    ev_dreamstime_l_324703167
    Automotive

    The Next Step in Power Conversion and Distribution for Vehicle Architectures

    Stellantis and Infineon signed supply and capacity agreements that will serve as the foundation for development of the next-gen power architecture for Stellantis’s EVs.
    Ceramic Packaging: When You Really Need Rugged
    Industrial

    Ceramic Packaging: When You Really Need Rugged

    Remtec offers a proprietary technology to overcome challenges presented by ceramic packaging and substrates in rugged-system design.
    Dreamstime_spbphoto_40204191
    Vacuum tubes
    Analog

    Modeling on Mondays: Nonlinear SPICE Models of Vacuum-Tube Triodes (Part 3)

    Recognizing the nonlinear behavior of the 12AX7 vacuum tube, used in audio and old op-amp applications, Dr. Dyer compares various models for fit to real-world device data.
    Dreamstime__prostockstudio__340085677
    Advanced electronics for defense systems
    Industrial

    Flexible Computing Design for Advanced System Development

    This article maps out how high-performance computing technologies can be constructed into modern embedded systems, focusing on the usability of open standards-based computing ...
    iStock
    Balancing environmental conditions with processing challenges for rugged systems
    Industrial

    Harness AI Computing in Demanding Industrial Environments

    Reliable communications, at-the-edge AI processing, and a wider range of environmental conditions are just some of the aspects that rugged systems designers need to account for...
    University College London
    University College London's ultrafast, ultrawideband link
    Wireless

    Synced Wireless Electronic + Photonic Link Approaches 1-Tb/s Capacity

    This ultrawideband link aggregates and synchronizes multiple parallel channels for ultrafast capability.
    Stellantis
    Factorial solid-state battery tech in Stellantis demo vehicles
    Automotive

    Pushing the EV’s Future Closer with “FEST” Solid-State Batteries

    Stellantis and Factorial unveiled the next chapter in their partnership with the latter’s solid-state battery technology, which offers over 390Wh/kg energy density. It will debut...
    Lake Shore Cryotronics
    Lake Shore Cryotronics' Source Measure Units Optimized for Testing Emerging Nano/2D Semiconductor Devices.
    Test & Measurement

    SMU Optimized for Testing Nano/2D Semiconductor Devices

    Lake Shore Cryotronics' SMU module for its M81-SSM instrument brings laboratory-grade, low-level measurement capabilities to a benchtop instrument.
    ID 2725496 © Brian T. Young | Dreamstime.com
    Learning about SPICE modeling
    Analog

    Modeling on Mondays: SPICE Modeling of Common Active Devices—An Overview (Part 1)

    Engineering is all about choosing the best compromise—both for a SPICE model that provides reasonable fidelity and for the tools enabling that model to be employed.