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Technology Advancements

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Power Protection

A Divide-and-Conquer Approach for Fail-Safe Circuit Protection

Explore a system-level approach to achieving high functional safety using decomposition rather than traditional monolithic architectures.
Sept. 2, 2026
What’s New in UCIe 3What’s New in UCIe 3
EDA

What’s New in UCIe 3.0?

Sept. 2, 2026
AI-Driven Infant Monitoring SolutionAI-Driven Infant Monitoring Solution
Machine Learning

Infant Monitoring Solution Driven by Agentic AI

Aug. 31, 2026
MIT
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Industrial

What are Strain-Tunable Thermal-Conductivity Applications?

Aug. 31, 2026
Advantest
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Test & Measurement

System-Level Test for Next-Generation AI and HPC Devices

Aug. 28, 2026
ID 7261446 © Mikhail Dudarev | Dreamstime.com
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Analog

Calculating Temperature Coefficient in Precision Analog Circuits

Aug. 24, 2026
ID 248204704 © Sudarat Thongpu | Dreamstime.com
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Power

World’s First 2,200-V GaN Tech Eyes High-Voltage EVs, Data Centers

Aug. 24, 2026
University of Illinois/Urbana-Champaign
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Power

Passive 3D Thermal “Cloak” Hides Objects from Heat

Aug. 21, 2026
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EDA

PCIe Prepares for the 3D Era

Aug. 19, 2026

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