Multiphysics Modeling for Electronics Thermal Management

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As electronic devices grow more compact and power-dense, managing heat has become one of the defining engineering challenges across industries — from consumer electronics to electric vehicles, data centers, power electronics, 5G infrastructure, and more. Thermal performance now directly limits reliability, efficiency, and product lifespan, making it a central concern for electrical, mechanical, and thermal engineers. Multiphysics simulation offers a practical way to address these coupled challenges, enabling engineers to predict how electrical losses, heat transfer, fluid flow, and material behavior interact long before a physical prototype exists.

In this webinar, we will explore how the COMSOL Multiphysics® software can be used to tackle electronics thermal management challenges. We will discuss how simulation workflows can be used to evaluate cooling strategies, identify hotspots and thermal pathways, optimize heat sinks and enclosures, and account for the interplay between Joule heating, conduction, convection, and radiation in real designs. Additionally, we will demonstrate the efficiency of lumped parameter modeling for complex components, including integrated circuits and thermoelectric coolers. We will also discuss how coupling thermal analysis with electromagnetics, structural mechanics, and CFD provides a more complete picture of system behavior.

By the end of the webinar, attendees will have a clearer understanding of where simulation fits into the electronics design workflow, what kinds of thermal questions it can answer earlier and more cost-effectively than physical testing, and how a multiphysics approach supports more reliable, efficient, and innovative electronic products.