WEBINAR

Designing for the Future: 3M Interconnect & Electronics Solutions for Next-Generation Applications

From connectors and cable assemblies to EMI absorbers and protective materials, learn how to simplify complex design challenges, reduce risk, and speed procurement. Join this expert-led session. Register today!
October 28, 2026
3:00 PM UTC
1 hour

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As electronics continue to evolve toward greater miniaturization, higher performance, and increased reliability demands, engineers and procurement professionals face mounting pressure to source solutions that address multiple design challenges simultaneously. 

Walk through a portfolio of proven solutions designed to meet these challenges head-on. Targeting design engineers, hardware engineers, and procurement professionals in the industrial, machine vision, and electronics manufacturing sectors, this session will cover 3M's Interconnect portfolio - including MDR/SDR connectors, Clamp Series I/O connectors, Molded-on Cable Assemblies, and Industrial Camera Cable Assemblies - alongside complementary products including EMI Absorbers, Bumpon cushioning materials, and Polyimide Tapes.

Audience members will gain a clear understanding of how these solutions address common pain points such as signal integrity degradation, electromagnetic interference, mechanical instability, and component protection in demanding environments. Presenters Joe Petri and Gregg Couture will share application insights drawn from decades of combined industry experience, helping attendees connect product capabilities directly to their real-world design challenges.

Leave with actionable knowledge to accelerate design decisions, reduce development risk, and leverage TTI's stocking portfolio for faster procurement cycles - ultimately delivering greater value and efficiency to their business and end customers.

Key Points:

  • Overview of 3M MDR/SDR and Clamp Series connector solutions
  • Molded-on Cable Assemblies and Industrial Camera Cable Assembly applications
  •  EMI/RFI management with 3M EMI Absorbers
  • Cushioning and protection with 3M Bumpon products
  • Masking and insulation with 3M Polyimide Tapes
  • Addressing miniaturization, signal integrity, and mechanical stability challenges
  •  How TTI's stocking portfolio supports design-in and procurement efficiency
  •  Live product demo and Q&A

Speakers:

Greg Couture

Greg Couture

Interconnect Sales and Channel Leader

3M

Gregg Couture is the Interconnect Sales and Channel Leader at 3M, where he is passionate about influencing OEM design specifications with his technical sales team, and driving the channel strategy for 3M’s Interconnect portfolio. With more than 24 years of experience in the electronics industry, Gregg has been selling 3M Interconnect solutions for the last 18 years addressing key design challenges such as signal integrity, miniaturization, and mechanical stability across countless customer applications. 

Joe Petri

Joe Petri

Sales Manager for Display and Electronics Product Platforms - US & Canada

3M

Joe Petri is the Sales Manager for Display and Electronics Product Platforms for the United States and Canada at 3M, where he drives technical specifications and customer engagement for a portfolio that includes EMI/RFI management solutions, electronic assembly materials, and eAbrasives. In this role, he works closely with OEMs and engineers to help design and enable next-generation electronic solutions, addressing challenges related to miniaturization, performance, and reliability. Joe has been with 3M for 18 years and has spent the past 8 years within the Display and Electronics Product Platform, building deep expertise in its technologies and customer applications. He previously served as a portfolio manager within 3M’s industrial division, where he developed a strong foundation in product strategy and market-driven innovation.

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