WEBINAR

The "Mortar Between the Bricks" - Interconnects in Open Standards

Learn how open standards drive interoperability and innovation in embedded computing. Explore key organizations like SGET, PICMG, and VITA, discover why interconnects are critical to open architectures, and see how Samtec solutions help simplify adoption and accelerate development. Register today to gain practical insights for your next embedded design. Register now!
October 20, 2026
3:00 PM UTC
1 hour

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Open standards foster collaboration between like-minded companies focused on developing an open specification solving a specific embedded computing industry need. Members range from small technology specialists to the largest publicly traded companies in Silicon Valley. Core values of open standards include consensus, interoperability, vendor neutrality, and accessibility, enabling HW/SW systems to communicate seamlessly.

In the embedded computing ecosystem, there are several industry standards bodies. Attendees will learn about several key industry standards bodies. SGET focuses their efforts on MCU and FPGA-based applications. PICMG mainly focuses on high performance. VITA focuses on real-time, modular critical embedded computing systems. These and others are complementary and essential.

As open standards typically define electromechanical system architectures, connector definition and selection remain a crucial and important part of the standards development process. They are the “Mortar Between the Bricks.” During the webinar, an overview of Samtec opens standards will be presented. Additionally, the presenter will explore the flexibility of open-pin-field arrays that simplify adoption in open standards.

Key Takeaways:

  • Open Standards - What are they?
  • Key Embedded Open Standards
  • Interconnects Essential for Open Standards
  • Key Samtec Open Standard Interconnect Solutions

Speaker:

Matthew Burns

Matthew Burns

Global Director, Technical Marketing

Samtec

Matthew Burns develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 25+ years, he has been a leader in design, applications engineering, industry standards, technical sales and marketing in the telecommunications, medical and electronic components industries. He currently serves as Secretary at PICMG. Mr. Burns holds a B.S. in Electrical Engineering from Penn State University.

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