You can benefit directly from decades of "lessons learned" in real-world applications in space on the latest advancements in hermetic packages for power devices in a rad hard environment.
March 26, 2026
Sponsored by
lowreslogo_irhirel_rgb
This application note will describe the challenges of thermal mismatch and share the advancements in package design that help mitigate thermal stresses and ESD events in rad hard environments.
