| | | | | | | | A new type of logic supports high-performance computing and quantum computers. |
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| | | | | | Sponsored | | Meet the ADLINK COM-HPC-mPTL, a rugged COM-HPC Mini module packing next-gen Intel® Core™ Ultra Series 3 power into an ultra-compact 95x70mm footprint. Unleash up to 180 TOPS for edge AI across integrated CPU, GPU, and NPU engines. With blazing-fast PCIe Gen5 support, it delivers server-class bandwidth for space-constrained, 24/7 applications. Scalable, secure, and future-proof. |
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| | | | | | | | Power Integrations said its GaN-based auxiliary power supplies bring space and component savings to 800-V DC AI systems. |
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| | | | Browse resources, videos, and tools to get answers your basic to advanced embedded design questions. A portfolio of affordable and scalable embedded products, software, and design resources helps you find the best combination of features, performance, price, and package types to meet design needs. |
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| | | | | | | | Whether measuring distance or making it easier to create accurate and detailed 3D mapping, LiDAR is quickly becoming a go-to technology for multiple applications. |
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| | | | Solder’s days are numbered. There’s a better alternative that, essentially, reverses the manufacturing process. |
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| | | | | | Sponsored | Amphenol ExtremePort™ QSFP+ I/O connector systems deliver high-speed, high-density connectivity for data center and networking applications, supporting reliable performance and robust signal integrity. |
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