Electronic Design Today - Jul 7th, 2026
Electronic Design Today |
View online
July 7, 2026
Solder-Free and Scaling Up: Occam Process vs. Conventional Soldering in PCB Assembly
As electronics push toward miniaturization, higher reliability, and greener manufacturing, a solder-free assembly paradigm is gaining serious traction among design engineers.
Read More
SPE PHYs Integrate MACsec, TSN, and Functional-Safety Support
Microchip’s LAN8x8x family of single-pair Ethernet PHYs support secure and deterministic Ethernet connectivity for automotive and industrial systems.
Read More
Quick Poll: How are You Using AI on the Edge?
Find out how others are applying AI in edge applications.
Read More
From the Archives
Does This Chip Hold the Future of the Semiconductor Industry?
Learn more about Pike Creek and its potential implications as the first test chip featuring chiplets linked by the UCIe standard.
Read More
Tailoring the Design of Transimpedance Amplifiers to Infrared Sensor Apps (Part 1)
Part 1 of this two-part series introduces transimpedance amplifiers and describes their application in laser rangefinders and LiDAR systems.
Read More