GSA Revitalizes Test Interest Group With New Leadership and Focus
SAN JOSE, CA, June 13, 2011
The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces the appointment of Dan Hamling, Senior Director, IC Test and Assembly Business Development, GE Global Electronics Services, to serve as the GSA Test Interest Group chairman. Hamling was chosen for this position for his industry expertise, established credibility, and contribution to GSA’s past test-related efforts. His first action as chairman will be to establish a new mission, objectives, and initiatives for the Test Interest Group.
“I am honored to have the support of GSA and the knowledge of test industry leaders as we seek solutions to the challenges facing semiconductor test, both today and tomorrow,” commented Mr. Hamling. “I am looking forward to working alongside these experts to produce meaningful results for the industry as we explore tough topics such as 3-D IC test flows and test capacity management.”
Prior to joining GES, Mr. Hamling was founder and CEO of Chip Nexus, a provider of test capacity management software solutions. Before that, Mr. Hamling spent 12 years in sales and marketing at Teradyne following eight years in test engineering and test engineering management roles at various semiconductor companies. Hamling has a B.S.E.E. from the University of Michigan, an M.S.E.E. from Stanford University, and an M.B.A. from the University of Texas.
“We are pleased that Dan Hamling will represent GSA’s interests in test, adding his vision to GSA’s,” said Jodi Shelton, president of GSA. “Dan’s experience and knowledge will make a great impact on our membership and the industry as a whole through the initiatives he will lead within the Test Interest Group.”
About GSA
The Global Semiconductor Alliance mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective ecosystem through collaboration, integration, and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test, and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. http://www.gsaglobal.org/