Semi 14 12 02

SEMI forecasts nearly $44 billion equipment sales in 2015

Dec. 2, 2014

Tokyo, Japan. SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3% to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition. In 2015, strong positive growth is expected to continue, resulting in a global market increase of 15.2% before moderating in 2016.

The SEMI Year-end Forecast predicts that wafer processing equipment, the largest product segment by dollar value, is anticipated to increase 17.8% in 2014 to total $29.9 billion. The forecast predicts that the market for assembly and packaging equipment will increase by 30.6% to $3.0 billion in 2014. The market for semiconductor test equipment is forecast to increase by 26.5%, reaching $3.4 billion this year. The “Other Front End” category (fab facilities, mask/reticle, and wafer manufacturing equipment) is expected to increase 14.8% in 2014.

For 2014, Taiwan, North America, and South Korea remain the largest spending regions. In terms of percentage growth, SEMI forecasts that in 2015, Europe will reach equipment sales of $3.9 billion (47.9% increase over 2014), Taiwan will reach $12.3 billion (28.1% increase), and South Korea sales will hit $8.0 billion (25.0% increase).

The following results are given in terms of market size in billions of U.S. dollars:

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Book-to-Bill Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Year-end Forecast, which provides an outlook for the semiconductor equipment market.

www.semi.org

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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