EE – March 2017 Product Picks

FMC+ connector set

A new family of FMC+ high-speed board-to-board connectors helps support the expanded interface and faster speeds of the latest FMC+ applications in accordance with the new ANSI/VITA 57.4-2016 standard, which extends the capabilities of ANSI/VITA 57.1-2010 in support of the increased number and data rates of multigigabit interfaces found in advanced FPGA architectures. The standard increases multigigabit interfaces from 10 to 32 and multigigabit interface data rates from 10 Gb/s to 28 Gb/s and maintains backwards compatibility with VITA 57.1 FMC modules.

The ANSI/VITA 57.4-2016 standard defines two mated connected pairs that embody the new FMC+ electromechanical interface. A new High Serial Pin Count (HSPC) connector contains 560 pins arranged in a 14 x 40 array. The HSPC connector supports up to 24 multigigabit interfaces. A second, optional High Serial Pin Count extension (HSPCe) connector contains 80 pins in a 4 x 20 array. The HSPCe connector supports up to eight additional multigigabit interfaces. Samtec

Roundness, cylindricity measurement system

The RA-6000CNC is a custom-built CNC roundness/cylindricity measuring system, which, the vendor says, offers best-in-class accuracy. It is designed to measure large, heavy, cylindrical workpieces generally associated with automotive, energy, marine, and aviation applications.

The RA-6000CNC accommodates large, heavy work pieces requiring roundness/cylindricity evaluations. The maximum table-loading capacity is 350 kg, the maximum probing diameter is 880 mm, and the maximum probing height is 1,050 mm. Measuring range (diameter and height) is customizable depending on customer requirements. Mitutoyo

Ethernet/IP test platform

PacketExpert—a quad port Ethernet/IP tester—has been enhanced to support the RFC 6349 framework for TCP throughput testing. To verify Ethernet/IP-based networks, current widely used standards are RFC 2544 or Y.1564. However, both these standards, meant for testing at Layer 2 or Layer 3 (Ethernet or IP layers), are not sufficient, the vendor reports, because they do not cover testing at TCP layer. The new ExpertTCP performs bidirectional TCP throughput measurements in combination with another unit at the remote location (other end of the network), it acts as the TCP server, and it supports both upstream and downstream testing. GL Communications

DMU process optimization

With the latest version of 3D_Evolution 4.0, the vendor provides tools to optimize DMU processes. The so-called “DMU Inspector Software Suite” has functions such as collision and clearance control as well as a geometric model comparison. Due to the multiprocessor calculation and an intelligent neighbor search, the calculation is accelerated and scalable. Calculation takes place on the exact B-Rep description so that a precise distinction can be made between contact and penetration.

Using the new software, work is being made easier for users due to a clearly arranged, graphically based presentation of results. Supplementing this, the module “3D_Analyser” quickly visualizes the analysis results as 3D models enabling a simple geometric security of large volumes. CoreTechnologie

Waveguide direct-read attenuators

A new line of waveguide direct-read attenuators is available in WR-42 to WR-10 waveguide standards operating in seven waveguide bands within the 18-GHz to 110-GHz frequency range. They boast ±2% typical attenuation accuracy and feature an easy-to-read drum scale and military-standard UG-style flanges. The minimum attenuation range is 0 dB to 50 dB with an insertion loss of 0.5 dB to 1 dB depending on the frequency range.

These direct-read waveguide attenuators can be used in many industries including aerospace, defense, industrial, telecom, instrumentation, and medical. They are in stock and ready for immediate shipment. Pasternack

Heavy-duty EMC case

The new 3U RackCase PRO is available in standard depths of 9.45, 13.78, and 18.11 inches (240, 350, and 460 mm), with custom depths available to special order. To reduce configuration time and cost, it does away with the need for drilling when installing chassis trays, brackets, and electromechanical components. The design provides all-round access during assembly with the top and base covers sliding into place once the unit has been populated with the housed electronics and other components. RackCase PRO has been designed for applications such as audio, broadcast, instrumentation, and other areas where EMC integrity could be an issue; the design ensures conductivity between all component parts of the assembly, providing EMC capability as standard. Verotec

Crystals for IoT

Several miniaturized, advanced crystal units have been developed specifically for the IoT market. The company used its proprietary technology and volume production capability to design a product line that offers quality and reliability while also being cost-effective. The series features a compact package that allows for higher density mounting and use in lower profile devices. Target applications include mobile devices, wireless communication protocols, and medical and healthcare products.

The lineup includes the XRCED Series, which measures 1.2 x 1.0 x 0.33 mm. The XRCGB-F-H achieves ±10-ppm initial frequency tolerance to enable Bluetooth technology and meets the requirements for RF applications in a compact size. The XRCMD and XRCFD also offer a range of operating frequencies, temperatures, and tolerance ranges. Murata

PCB press-fit pins

Six new press-fit pins are designed for applications where mechanical strength and/or power delivery are essential. These new PCB pins feature multifaceted (polygon) geometries and are suitable for solderless PCB termination or for direct soldering to the board.

When these pins are pressed into a plated through-hole, the points (the major or circumscribed diameter) of the polygon are set or imbedded in the hole while the flat sides of the feature (minor or inscribed diameter) provide relief, allowing the remainder of the plated through-hole barrel to remain intact. The result is that internal board layers are not disconnected when the pin is pressed in. With a properly specified hole size, the polygon-shaped press-fit feature will allow the pin to be secured in the hole while maintaining continuity throughout all the layers of the PCB. Mill-Max

Wireless mesh network

The SmartMesh IP wireless sensor network product line has expanded to address the growing needs of industrial Internet of Things (IoT) applications. New capabilities include the SmartMesh VManager networking software, which seamlessly increases the mesh network capacity to thousands of nodes. The new Blink mode, an ultralow power roaming node capability, reduces average current consumption of wireless sensor nodes to less than 3 µA.

SmartMesh IP, based on 6LoWPAN, delivers wire-like reliability and ultralow power to wireless mesh networks, allowing secure deployment of battery-operated IoT sensors in harsh environments with more than 10 years of battery life. SmartMesh IP products are wireless chips and precertified PCB modules with ready-to-deploy wireless mesh networking software based on the 6LoWPAN and IEEE 802.15.4e standards. Linear Technology

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