Fremont, CA. Saki Corp. has announced that it will introduce its new 3Di automated optical inspection (AOI) systems at productronica November 14-17 in Munich. The new system delivers high-speed (5,700 mm2/s), high-accuracy (XY positioning of 3 µm at 3σ), height repeatability (below 2 µm at 3σ), and scalable resolutions of 7, 12, and 18 µm for boards weighing 12 kg.
On display will also be Saki’s new 3D solder paste inspection (SPI) systems, the 3Si-LS2, 3Si-LD2, and 3Si-7µm. One common software platform supports all Saki 3D inspection systems – solder paste, optical, and X-ray—with an easy-to-program, intuitive software wizard. Autoprogramming software significantly reduces library creation time, as libraries are automatically created using Gerber and CAD data. Algorithm-based software provides extensive programming capabilities, even for nonprogrammers. Saki’s inspection data and default thresholds adhere to IPC standards.
Saki is also introducing its new concept, Quality Driven Production, or QDP. QDP is a set of tools that ensures that the data and information that is communicated to third-party systems is valid and accurate. It improves the stability of the process, while at the same time it increases productivity and minimizes the operating cost of the equipment. A self-diagnostic system with predictive and preventive maintenance management assures stable machine conditions and repeatable, consistent performance. Every key component is monitored along with system conditions, and a detailed diagnostic log is recorded. An optimized preventive maintenance plan reduces maintenance time, machine down-time, manpower, and costs, the company reported.
The Multi Process View (MPV) on the BF2-Monitor shows the results of all inspection processes (SPI, pre-reflow, and post reflow) on one screen in real time for operator review, simplifying the verification process and making it less subject to error. It is also useful for analyzing the cause of a defective board.
“We are excited to introduce our new 3D AOI and 3D SPI systems to the industry at productronica and to discuss our Smart Factory/Industry 4.0 initiatives and partnerships,” said Katsuhiro Eddie Ichiyama, general manager of SAKI Europe. “In addition to these systems, we will also be displaying Saki’s 3D automated X-ray inspection (3D AXI) for circuit boards in applications that are too critical to fail.”