Thermal Spreader Challenges Heat Pipes

Oct. 8, 2008
Claiming 30% better thermal performance than heat pipes, the company's second-generation NanoSpreader vapor chambers report improvements in thermal transfer properties from the heat source to the vapor in the realm of 66% over the first generation. A

Claiming 30% better thermal performance than heat pipes, the company's second-generation NanoSpreader vapor chambers report improvements in thermal transfer properties from the heat source to the vapor in the realm of 66% over the first generation. A re-engineered internal structure leverages the company’s patented technique of combining copper, liquid, and vapor technologies. The components encase two-phase vapor chambers into which pure water is vacuum sealed. A copper wick absorbs the liquid then passes it off as vapor through a micro-perforated copper sheet where it cools and returns as liquid to the wick. For microprocessor applications, NanoSpreaders can cool power densities up to 150 watts/cm2 while enabling multi-directional thermal spreading as low as 0.02°C/W. Other suitable applications include telecomm equipment and LED lighting. The second-generation devices are available now with prices starting at less than $2 each. CELSIA TECHNOLOGIES INC., Miami, FL. (305) 529 -6290.

Company: CELSIA TECHNOLOGIES INC.

Product URL: Click here for more information

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