Vicor Unveils V*I Chip Bus Converters

5/19/2003 Edited byPETech Staff Vicor Unveils V*I Chip Bus Converters Vicor Corp. has introduced the first family of products based on its new V*I Chip ball grid array (BGA) surface-mount (SMD) power component. The new family consists of 48V to 12V Bus Converter Modules (BCM) for conventional Intermediate Bus Architecture (IBA) applications. The V*I Chip BCMs provide breakthrough performance relative to classic brick bus converters at a fraction of the cost.

The V*I Chips (VICs) of Factorized Power, a disruptive technology recently launched by Vicor, can process up to 200W in a small and light power BGA package. VICs are functional building blocks deployed as SMD components to create a flexible factorized power system. Conventional IBA applications are supported by narrow input range VIC models.

The 200W BCM Model B048K120T20 requires only 0.85 in. x 1.26 in. (21.5 mm x 32 mm) of board space— than one-third the board area of intermediate bus converters in quarter-brick style packages. Available in two mounting styles, it has an above-the-board height of only 4 mm (in-board mounting) or 6 mm (on-board mounting). Power density is 800W/in3—five times better than quarter-brick bus converters. And, unlike conventional switching regulator ICs, BCMs do not require external parts to perform their function. The B048K120T10 (rated at 100W) and B048K120T15 (rated at 150W) support lower power applications in the same VIC package.

Efficiency exceeds 96% over a wide load range. The V•I Chip BGA power component is easily cooled through its Junction-to-Case and Junction-to-BGA thermal paths. The 100W B048K120T10 requires no discrete heat sink in a typical application with 200 LFM of 55°C air. The B048L120T20, with its optional integral pin fins, is capable of full load operation at 200W with 300 LFM of 80°C air.

For more information, visit www.vicorpower.com.