The demand for high-density surface mounting technology is constantly evolving, particularly for mobile electronic devices. Murata's GRM02 series enhances the process of downsizing and surface-mounting density of mobile electronic devices such as cellular phones. Another highlight of this series is the outer terminal of the device, which features an electroplated structure offering excellent soldering heat resistance.
Murata advanced the processes of printing, laminating and cutting to create a thin-layer dielectric material. This special material allows for a higher capacitance value of 10,000 pF to be achieved in the ultrasmall size 01005.
In addition, the GRM02 series takes up approximately 50% less board space and offers a volume reduction of approximately 70%. The reduction of length from 0.6 mm to 0.4 mm assists in lowering the inductance level making the capacitor fitting for higher frequency applications.
For more information, visit www.murata.com.