Electronic Design

IR Grants Packaging License To Infineon

Infineon Technologies has been given a license for International Rectifier's patented DirectFET advanced power management packaging technology. Tailored to ac/dc and dc/dc power conversion applications, the DirectFET power package is considered to be the industry's first surface-mount power MOSFET packaging technology providing efficient topside cooling in an SO-8 footprint or smaller. Compared to plastic packages, its metal-can construction enables dual-sided cooling to essentially double the current handling capacity of high-frequency dc/dc buck converters. Infineon plans to employ this technology in its OptiMOS 2 and OptiMOS 3 chip technology and expects to sample OptiMOS 2 in DirectFET packages early in 2008

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.