Fast Curing Adhesive Has High Thermal Conductivity

Oct. 1, 2002

A new fast-curing, two-component epoxy adhesive has a thermal conductivity greater than 22 BTU/inch/square-foot/hour/°F. Volume resistivity of the EP24AN is greater than 1013 W-cm. This material has a one-to-one non-critical mix ratio weight or volume. It adheres to a wide range of similar and dissimilar substrates and can achieve a tensile shear strength of more than 1,600 psi. Gel times can be obtained in 20 minutes. The product claims a low coefficient of thermal expansion, low shrinkage and dimensional stability. It comes in half-pint, pint, quart, gallon and five-gallon kits. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.

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