Heatsinks Boast Of Advanced Thermal Design To Tackle Demanding Apps

Sept. 1, 1998

By combining a convoluted fin pack with an extruded base, the Hexfin family of heatsinks reportedly is able to meet the demanding thermal management needs of new computer, telecomm and power supply designs. The heatsinks' enhanced performance and cost-effectiveness are said to derive from their ability to accommodate lower thermal resistance requirements. The devices also are engineered to provide considerable design flexibility.

About the Author


Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations


To join the conversation, and become an exclusive member of Electronic Design, create an account today!