EDA News

July 19, 2004

To accelerate adoption of amba axi technology, ARM and Synopsys are collaborating on applicable verification IP. AMBA AXI technology is a next-generation on-chip interface that supports multilayer interconnect designs and provides 1.6 Gbytes/s of per-layer data throughput at 200 MHz. The verification IP provides built-in support for coverage-driven constrained-random test verification, including features expected to be published in the SystemVerilog Verification Methodology Manual, jointly created by ARM and Synopsys. It will be available at no charge to Synopsys DesignWare subscribers in the fourth quarter of 2004. For more, visit www.designware.com.

A free hf component kit from Taiyo Yuden comes bundled with a copy of Ansoft Designer SV design simulation software and Taiyo Yuden's RF Component Library, which contains enhanced high-frequency performance data for use in circuit simulations. The sample kit provides an assortment of capacitors, ferrite beads, and multilayer inductors that are included on the accompanying RF Component Library CD. Utilizing enhanced-accuracy S-parameters, the RF Component Library data produces extremely narrow deviations between simulated data and actual measurements in high-frequency circuit design. For further information about the kit, visit www.t-yuden.com or www.ansoft.com.

About the Author

David Maliniak

MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.