High-Frequency Design Tool Gains In Efficiency

Sept. 1, 2005
With version 10 of Ansoft's HFSS high-frequency/high-speed electromagnetic design tool, designers can share CAD models and results across existing CAD/CAE design environments. Also, its dynamic-link technology lets HFSS cosimulate with other Ansoft tools

With version 10 of Ansoft's HFSS high-frequency/high-speed electromagnetic design tool, designers can share CAD models and results across existing CAD/CAE design environments. Also, its dynamic-link technology lets HFSS cosimulate with other Ansoft tools and extends HFSS applications to include RF/analog IC co-design, EMI/EMC, and microwave heating.

The ability to reuse third-party CAD models and EDA layouts saves HFSS users engineering time and gives them more time to optimize performance. HFSS v10's highlights include new geometry translation, model resolution, and meshing technology implemented in an auto-interactive user interface. The interface renders electrically unimportant geometric artifacts invisible to the simulation and characterization process.

The tool also features new incident wave additions of plane, spherical, cylindrical, Gaussian, and linear antenna-wave types that broaden HFSS's utility to compute antennas and scattering applications into the optical domain. An improved analysis configuration, control, and management capability allows designers to use available hardware resources and distribute analyses over a network of computers, reducing overall analysis time.

HFSS v10 is available on Windows 2000, XP, Server 2003, and XP Professional x64; Sun Solaris 8+; HP HP-UX 11+; and Red Hat Enterprise Linux v3. Prices start from $48,900 for a floating perpetual license.

Ansoft Corp.
www.ansoft.com

About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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