Employing the company's radial folded fin design, the copper core Radial Fin heatsinks are designed for application with SECC2 and PGA microprocessors found in PCs, workstations and servers. These cooling devices generate a 360° airflow that is said to result in higher volumetric efficiency and lower fan noise than traditional extruded heatsinks.
All models feature a high fin count and hollow copper core that minimizes weight without decreasing performance. The heatsink is priced starting at $6.25 each/5,000.
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