Thick-Film Hybrids Eliminate Solder Joints

May 1, 2001

These thick-film hybrids consist of screened resistive, conductive and dielectric inks on ceramic based substrates, with the inks subsequently fired at temperatures ranging from 600°C to 850°C to form passive circuit components and conducting lines. To complete the circuit, other passive and active components, including SMDs, are attached by reflow soldering. The hybrid circuits are subjected to both passive and active trimming by laser techniques, thereby offering closer working tolerances. In addition, many solder joints are eliminated, increasing the circuit's reliability. The ceramic-based materials have a high breakdown voltage, with the ceramic substrate also able to conduct heat away from the circuit. The company can provide quotations based upon sample circuits or circuit diagrams. There is a minimum order quantity of 1,000 pieces. Typical tooling costs are $1,000, with samples shipped in 45-60 days and the first production quantities shipped 60 days after approval.


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