Thermal Interface Material Shows 50% Improvement In Thermal Impedance

May 1, 2002

T-pcm HP105, a phase-change type thermal interface material with lowest thermal impedance, is a 0.005( thick, non-electrically conductive film that is naturally tacky at room temperature. The material begins to soften and flow at 50(C, filling the microscopic irregularities of both the component and thermal solution, thus reducing thermal interface resistance. The thermal impedance is 0.024(C-in2/W @ 10 psi and 0.017(C-in2/W @ 50 psi. T-pcm HP105 is naturally tacky and requires no additional adhesives or preheating of the heat sinks for assembly. The material is supplied in rolls with a red top tabbed liner for easy application. Individually die cut shapes can also be supplied. THERMAGON, INC., Cleveland, OH. (888) 246-9050.

Sponsored Recommendations

Near- and Far-Field Measurements

April 16, 2024
In this comprehensive application note, we delve into the methods of measuring the transmission (or reception) pattern, a key determinant of antenna gain, using a vector network...

DigiKey Factory Tomorrow Season 3: Sustainable Manufacturing

April 16, 2024
Industry 4.0 is helping manufacturers develop and integrate technologies such as AI, edge computing and connectivity for the factories of tomorrow. Learn more at DigiKey today...

Connectivity – The Backbone of Sustainable Automation

April 16, 2024
Advanced interfaces for signals, data, and electrical power are essential. They help save resources and costs when networking production equipment.

Empowered by Cutting-Edge Automation Technology: The Sustainable Journey

April 16, 2024
Advanced automation is key to efficient production and is a powerful tool for optimizing infrastructure and processes in terms of sustainability.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!