A line of adhesive-backed, peel-and-stick heat sinks has been designed for use with BGAs, PGAs, PLCCs, QFPs, CSPs, mBGAs, flatpack packages and cooling applications with limited clip space. With the pre-applied adhesive, users can just peel off the release liner and press the heat sink onto the component. Standard adhesives or greases are no longer required to achieve a solid mechanical bond. The heat sinks are omnidirectional and have a thermally optimized pin fin. Adhesive shear strength at 100ûC is 36 psi. IERC, Burbank, CA. (818) 842-7277.