EE Product News

Adhesive Backed Heat Sinks Install Cleanly

product pic

A line of adhesive-backed, peel-and-stick heat sinks has been designed for use with BGAs, PGAs, PLCCs, QFPs, CSPs, mBGAs, flatpack packages and cooling applications with limited clip space. With the pre-applied adhesive, users can just peel off the release liner and press the heat sink onto the component. Standard adhesives or greases are no longer required to achieve a solid mechanical bond. The heat sinks are omnidirectional and have a thermally optimized pin fin. Adhesive shear strength at 100ûC is 36 psi. IERC, Burbank, CA. (818) 842-7277.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish