EE Product News

BGA Inspection System Finds Faults Missed By X-Ray

Claiming to be able to find the faults missed by X-ray inspection systems, the 3D-Bga inspection system detects hard-to-find faults such as the presence of flux, micro cracks, and cold solder joints. Using advanced 3 Chip Camera technology, the system features a lens design that delivers a depth of field from a magnitude of 50x to 200x and can look under a micro BGA with as low as 2 mm of clearance.The system comes with an ESD-safe ball-bearing boom stand for the camera module and a precision X-Y table. An optional real-time video scale and measurement system is also available. For further information and price, call O.C. WHITE CO., Three Rivers, MA. (413) 289-1751.

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