BGA Package Gets The Lead Out

May 1, 2000

The company has announced the development of lead-free BGA and µBGA packages. Conventional SnPb solder balls are replaced with a SnAgCu (tin/silver/copper) alloy. The devices are available as samples, along with lead-free solder pastes and different soldering profiles, for evaluation and qualification.

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Solving the contact resistance challenge for 7nm and beyond CMOS

Flash Memory Takes Over

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