A new heat sink design, called Wavy Fins with Copper Core, is said to effectively dissipate the heat generated by the Pentium 4 microprocessor. Due to the small size and high heat load of the Pentium 4, the new heat sink has a small footprint and a copper core that efficiently spreads heat from source to the fins. In addition, the fins are formed into a wavy shape to facilitate the air flow and achieve higher heat exchange capability. This design can also be used to cool similar high- power devices. For additional information, contact Harry Lin at ACK TECHNOLOGY, INC., Buena Park, CA. (714) 739-5797.