Cadence Acquires Clear Shape To Strengthen Its DFM Portfolio

Aug. 17, 2007
Cadence Design Systems has acquired Clear Shape Technologies Inc., a design-for-manufacturing (DFM) technology company specializing in design-side tools for minimizing silicon yield loss. These capabilities can be applied to designs ranging from SoCs to f

Cadence Design Systems has acquired Clear Shape Technologies Inc., a design-for-manufacturing (DFM) technology company specializing in design-side tools for minimizing silicon yield loss. Combined with Cadence's existing DFM methodologies and capabilities, the acquisition strengthens Cadence’s DFM portfolio, extending manufacturing awareness and lithographic correctness through all layers in an IC from transistor through interconnect. These capabilities can be applied to designs ranging from SoCs to full-custom as well as all design domains including analog, digital, and mixed signal.

Traditional manufacturing-side lithography analysis products take days, even weeks to run, which is unacceptable for competitive chip design. Clear Shape's technology aims to not only offer orders-of-magnitude performance improvements in detecting lithographic "hot spots," but also models the impact of optical processing variations on the electrical performance of the chip. Supposedly, this combination significantly improves and extends pre-tapeout DFM capabilities, it’s claimed.

Clear Shape's products are in the DFM qualification programs of the major semiconductor foundries. Clear Shape's InShape technology is the first qualified TSMC Reference Flow 8.0 lithography process checker for all levels (transistor through interconnect) for devices at 65 nm, 55 nm, and 45 nm.

The acquisition was completed on Aug. 15. Terms of the agreement have not been disclosed.

Cadence Design Systems

http://www.cadence.com

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!