An extensive line of SONET semiconductor packaging now spans sizes that can accommodate telecomm applications extending from OC-48 and OC-192 to R&D on the next generation OC-768 systems. These ceramic, glass and metal-based packages are used in the fiber-optics market for packaging a variety of semiconductors used in broadband SONET topologies. The packages maintain the integrity and electrical properties of high frequency components while providing thermal management where necessary. The packages can either be purchased from a number of off-the-shelf designs or custom configured to a specific need. Assembly services to package the chips are available. Features of the package include: ceramic or glass RF layers; metal, glass or ceramic bases; and leaded, leadless or surface-mount attachment.