EE Product News

Cooling Assemblies Target Sub-$1000 PCs

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With PC prices plummeting, pressure has rapidly built on component suppliers to develop more efficient and less costly products. In response to this, cooling assemblies have been developed that combine a heatsink that provides omni-directional airflow with a fan that is said to meet or exceed industry requirements for performance, cost, reliability and noise. The assemblies provide maximum cooling performance and are are aimed at uses in sub-$1000 PCs. The new, easy-to-attach heatsink-and-fan assemblies are available for CPUs made by Intel, AMD, Cyrix, IDT, and other companies- in instances where there is sufficient natural airflow, however, the processors reportedly may require only the heatsink to stay cool.

TAGS: Intel
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