Developed for microelectronics assembly and packaging, specifically for optoelectronics and sensor manufacture, TRA-BOND 2155 has a die shear strength of typically 19 kg. on a 100- x 100-mil pad. Thermal conductivity is greater than 0.9 W/mK with thin bond lines, adhesion is greater than 2000 psi when cured at room temperature and the ultimate Tg is 60°C. The epoxy can be cured at 25°C for 24 hours or heat cured at 65°C for 2 hours. Pot life is 3 hours and working life is up to 8 hours. And it is easily dispensed or screen printed.