EE Product News

Fan/Heatsink Spot Cools BGAs

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Optimized to cool ball grid array ICs, the initial offerings in the Pocket Cooler family of fan/heatsink assemblies are aimed at applications where space is at a premium. Model 3680 provides 1.5°C/W performance for cooling of Socket 7 CPUs and other ICs. Model 3681 is suited for high-power BGAs, and Model 3682 is a low-profile fan blower with an aluminum base that's used for systems that need airflow but can't use traditional cooling.Applications for the family include cooling microprocessors, upgrading existing passive BGA heatsinks, and spot cooling hot ICs. Pocket Coolers are lightweight units that stand from 7 mm to 15 mm tall.

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