EE Product News

Folded-Fin Heat Sinks Provide Better Cooling

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Claiming an approximate 30% improvement in cooling when compared with the extruded device with adequate air flow, the Folded-Fin heat sink has about 20 fins per inch (claimed as a new record in fin density) and is designed to cool power devices and CPUs. Measuring just 1.65" x 3.2" x 0.70" (standard size), the design of the heat sinks is also said to provide low unit cost and low tooling cost for custom design, as well as shorter lead times for custom design.

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