EE Product News

Gap Filling Materials Fit Unique And Irregular Surfaces

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Boasting of higher thermal conductivity than its standard Gap Pad materials, the firm's three new high-performance gap filling materials for the electronics industry include the Gap Pad 1500, Gap Pad 2000 and Gap Pad 3000. These high-performance materials are for use with high heat generating devices and conform to fit irregular surfaces and fill air gaps. The materials act as a thermal interface between electrical components and heat sinks. Some typical applications include heat pipe assemblies, drive cooling, RDRAM memory modules, and areas where heat needs to be transferred to a frame, chassis, or other types of heat spreaders.

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