EE Product News

Heatsinks Aid Power Semis

product pic

Expanding the company’s line of power semiconductor cooling products, the Therma-Fin folded heatsinks are capable of dissipating heat loads up to 2 kW. In addition to high-heat dissipation capability, the sink’s folded-fin design and the incorporation of heat-pipe technology make for a smaller and lighter components. Aluminum or copper fins can be epoxied to the cooling plate or soldered and brazed to increase reliability and minimize thermal resistance. Base options include vapor chambers, copper bases, aluminum bases, and copper or aluminum bases with embedded heat pipes. For prices, call THERMACORE INTERNATIONAL INC., Lancaster, PA. (717) 569-6551.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.