Utilizing folded fin technology, the Therma-Fin series heatsinks increase the surface area of the heatsink to more efficiently disperse heat in the cooling of communications equipment. By maximizing the surface area, the devices increase the flow of heat from the component into the air.Aluminum or copper fins can be epoxied to the cooling plate or soldered or brazed to increase reliability and to minimize thermal resistance. Base options include Therma-Base vapor chambers, copper bases, aluminum bases, and copper or aluminum bases with embedded heat pipes. The performance of the heatsink allows fans in the system to run at a lower speed for quieter operation. Multiple mounting options, including through-holes and clip designs, are available.