Archive Eepn Com Cluster Common Eepn Images Articles 18790

Interface Materials Can Replace Thermal Grease

Nov. 1, 1999

T-dux and Tdux II interface materials combine low thermal resistance and high strength in a product 4 mils or 5 mils thick. T-dux is a grease replacement that provides a uniform, void-free interface. The durable nature of the material resists changes due to hot and cold temperatures, yet remains soft enough to conform to mating surfaces.T-dux resists punctures, offers excellent thermal conductivity and contains no electrically conductive components that could short circuits during use. The material is available in sheets or die cut to any standard or custom shapes. It's also available with pressure-sensitive adhesive on one side for easy assembly.

Sponsored Recommendations

Design AI / ML Applications the Easy Way

March 29, 2024
The AI engineering team provides an overview and project examples of the complete reference solutions based on RA MCUs that are designed for easy integration of AI/ML technology...

Ultra-low Power 48 MHz MCU with Renesas RISC-V CPU Core

March 29, 2024
The industrys first general purpose 32-bit RISC-V MCUs are built with an internally developed CPU core and let embedded system designers develop a wide range of power-conscious...

Asset Management Recognition Demo AI / ML Kit

March 29, 2024
See how to use the scalable Renesas AI Kits to evaluate and test the application examples and develop your own solutions using Reality AI Tools or other available ecosystem and...

RISC-V Unleashes Your Imagination

March 29, 2024
Learn how the R9A02G021 general-purpose MCU with a RISC-V CPU core is designed to address a broad spectrum of energy-efficient, mixed-signal applications.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!