EE Product News


ORGANIC CHIP PACKAGE- A new organic chip package from W.L. Gore & Associates Inc., Eau Claire, WI, has been successfully qualified by the NEC Corp. The Via On Chip Pitch packages are said to be the only substrates where all interconnection vias through the package are on the same pitch as the die pins. As a result, the densities achieved exceed any other published organic packaging technology, it's claimed. NEC's qualification vehicle was a 15-mm2 flip chip test die in a 40-mm2 package with a full array of 1521 BGA balls on a 1-mm pitch. All industry-standard package reliability tests were performed and passed. NEC is the first supplier to qualify the Gore package for its flip-chip ASIC devices. Other semiconductor manufacturers are in the process of qualifying the package as well.

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