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Production Sockets Handle 0.50 mm Chip Packages

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A family of 0.50 mm lead-pitch sockets is intended for production, development, test and debug where a finer pitch socket is needed. Sockets available are a ball-grid array (BGA), chip-scale package (CSP), micro ball-grid array (MBGA) and land grid array (LGA). The sockets come in surface mount, through-hole and solderless styles and feature screw lock, knob lock or ZIF lock retention lids. Lead inductance is specified at less than 2 nH and contact life is rated is rated at 10,000 cycles minimum. EMULATION TECHNOLOGY, INC., Santa Clara, CA. (800) 232-7837.

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