RTL-To-GDSII Flow Rolls For Structured ASICs

Oct. 18, 2004
A collaboration between Magma Design Automation and ChipX has produced a unified RTL-to-GDSII structured ASIC design flow. Based on Magma's Blast Create and Blast Fusion tools, the flow supports ChipX's CX5000 family of structured-ASIC devices....

A collaboration between Magma Design Automation and ChipX has produced a unified RTL-to-GDSII structured ASIC design flow. Based on Magma's Blast Create and Blast Fusion tools, the flow supports ChipX's CX5000 family of structured-ASIC devices. The companies' mutual customers as well as ChipX itself will use it to deliver structured-ASIC designs or to migrate FPGA designs to the CX5000 parts.

Among the advantages offered by the Magma/ChipX flow are structure-specific optimizations to maximize area utilization and performance. Physical-synthesis technology tailored for the ChipX architecture handles physical site constraints and overlapping site locations. This technology lets the tools select and efficiently place the correct implementation of a functional cell to meet design-specific requirements.

The flow performs heterogeneous placement to simultaneously place cells and macros, including the placement of a large number of embedded and distributed memory blocks. Timing, power, and signal-integrity analysis is integrated with synthesis, floorplanning, placement and routing, clock-tree synthesis, physical timing optimization, and RC extraction. This level of integration brings fast design turnaround times and an efficient path to design closure.

ChipX will provide customer access to the flow as well as support functions.

Magma Design Automationwww.magma-da.comChipXwww.chipx.com

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!